Ormecon - Technology Leader in Printed Circuit Board Surface Finishes
- ORMECON CSN: established and renowned Immersion Tin
A first small revolution began in 1996, when Ormecon began to introduce ORMECON CSN which was already based on Nanotechnology: the pre-dip containing the proprietary Organic MetalTM forms an 80 nm thin non-permanent layer, and it enables an about 1 µm thick Sn layer to be deposited in a very precise and reliable way - the first fully reliable Immersion Tin worldwide.
The ORMECON CSN process family hence developed to become the most widespread Immersion Tin surface finish, used all over the world by more than 170 customers for more than 35 OEMs.
