10 years after market introduction of ORMECON CSN, Ormecon is now introducing a completely new family of surface finishes - "ORGANIC METAL NANOFINISH". It is based on a significant evolutionary progress in the further developments of our established OMP predips, the new OMP and OMN grades contain a small amount of silver, but they are based on a new formulation of our Organic Metal.
As a result, the layer formed now is permanent and only 55 nm thin. It is a complex between the Organic Metal (OM) and Silver (Ag), with less than 10% of the complex being Ag. 4 different processes will satisfy the diverse demands of the PCB finishing / assembly industry and help to >> save energy:
a 400 nm thin Immersion Tin, a 90 nm thin Immersion Silver, and two 55 nm thin OM-Ag finishes.
They all offer solderability for lead-free multi-step reflow assembly.
| ORGANIC METAL UNIVERSAL NANOFINISH | Surface characteristics | Market field |
| OM Nanonfinish, general grade | 50 nm, performance better than OSP | OSP medium requirements, HASL |
| OM SILVER NANOFINISH | 90 nm Ag, performing as ImAg with 250 nm | ImAg |
| ORMECON CSN NANOFINISH | 400 nm SN, predip OMP 7002 | ImSn |
| OMUN top grade | 50 nm, best performance | ENIG, HASL, top OSP |
OM Universal Nanofinish
The OM Universal Nanofinish is the universal final surface finish. It consists of just a 50 nm thin layer of an Organic Metal-Silver complex. 90% of the layer volume is purely organic and the effective silver layer thickness is only 4 nm.
The SEM photo above shows that the OM-Ag complex deposits preferably on the particle edges. The majority of the surface area seen in the SEM is copper, although it is not accessible for oxidation. The solderability of the surface is excellent even after 5 reflow aging steps.
OM Nanofinish Common Grade
The Organic Metal Nanofinish "Common Grade" represents a version of the product family for lower technical requirements. This surface finish also ensures multiple reflow solderability under lead free conditions. It therefore out performs all conventional OSPs.
OM SILVER NANOFINISH
The Organic Metal SILVER Nanofinish represents the nanotechnological alternative to all Immersion Silver processes. With a layer thickness of only 90 nm and with an effective silver layer of 10 nm, the finish optically resembles a silver surface of 250 nm with a comparable technical performance. The process also has a much higher capacity, as well as a much lower silver consumption.
CSN NANOFINISH
Through the increased requirements of lead free soldering conditions, the required tin layer thickness has significantly increased. Longer lines and immersion times with the corresponding higher costs and consumption are the results.
The consequent development of the Organic Metal based pre-dips before the tin bath has led to this new nano-technological generation of Immersion Tin processes. Through this it is possible to reach the same level of solderability after multiple soldering steps with a 400 nm tin layer where up to now 1 - 1.2 µm tin is required.
